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Q1:What is the application of heat sink?

A: A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.


Q2: What is heat sink used for?

A: A heatsink is a device that is attached to a microprocessor chip to keep it from overheating by absorbing its heat and dissipating it into the air. Generally, a microprocessor's temperature should not run in excess of 50-55 degrees Celsius while under a full load. In Intel computers, the heatsink is positioned either on top of the microprocessor (in computers with a ZIF socket) or on the side of it (in later Pentiums in which the microprocessor fits into a Slot 1 interface). The heatsink may be held in place on the microprocessor by a clip. To ensure that the heatsink can absorb as much heat as possible, thermal grease is used to create a seal between the two devices.When you buy a computer or a separate microprocessor, the heatsink comes with it. Most heatsinks are aluminum and have "fins" that extend from the base. An active heatsink is one that comes with a fan, sometimes called a heatsink/fan combo (HSF). A passive heatsink is one that comes without a fan.


Q3:How to design a heat sink?

A: A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the temperature of the integrated circuit. Thermal adhesive or thermal grease improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of copper and/or aluminium. Copper is used because it has many desirable properties for thermally efficient and durable heat exchangers. First and foremost, copper is an excellent conductor of heat. This means that copper's high thermal conductivity allows heat to pass through it quickly. Aluminum is used in applications where weight is a big concern.


Q4: How to choose/select a heat sink?

A: As you look for the best custom heatsink for your needs, you should consider a number of factors regarding your specific heatsink requirements. You should look for a heatsink that will fit into the area you need; this is often easiest with a custom model that can be designed to fit your needs. Since different systems are often used for cooling, you should be sure to choose a heatsink that works with whatever cooling method you are using. You may also want to consider whether you need a custom heatsink, or if you can use one already in mass production.

A custom heatsink is a device designed and created specifically for a particular individual or use. Heatsinks are devices that transfer heat away from electronic systems and devices, such as processors in computers. When choosing a custom heatsink, you should be sure to carefully measure the space in which the heatsink will be placed to ensure it will fit. This is especially important for systems in which space may be minimal, since heatsinks can be fairly large and often require sufficient area for heat displacement.


Q5: Heat sinks basic theory.

A: There are three ways how an object can get rid of heat: Radiation, conduction, and convection.

Radiation, as the name suggests, means that the heat is simply radiated away from the object, through electromagnetic radiation (photon transport). This effect is not bound to gas or other substances surrounding the heatsink. Radiation will even take place in a vacuum. How well an object can radiate heat depends on the material and the color (black is best).

Conduction is the exchange of kinetic energy between molecules. Less energetic (lower temperature) particles gain kinetic energy by colliding with more energetic particles (through physical contact). Since direct contact is required, a heatsink (surrounded by air) cannot get rid of heat using conduction. However, conduction is the effect that's responsible for the heat transfer from the CPU to the heatsink.

Convection is heat transfer by movement of a heated substance (gas or liquid). This means that the heat is transferred to the molecules of the gas (or liquid) surrounding the hot object, and then transported away through movement of molecules. If the gas or liquid around the object is forced into movement (e.g. by a fan blowing air across a heatsink), then we're dealing with forced convection .


Q6: What is heat sink compound?

A: Heatsink compound is a substance used in the installation of heatsinks, usually on a central processing unit (CPU) or similar computer device, to assist in effective heat transfer. A number of different substances can be used in making such compounds, though ceramic materials such as zinc oxide and beryllium oxide are quite common, as are metallic substances like silver and aluminum. Carbon fibers and even diamond powder can also be used in making these compounds, and though quite effective, such formulas are also significantly more expensive than the other types. Heatsink compound may not always be necessary for heatsink installation, as some heatsinks come with similar products already applied by the manufacturer.

Sometimes also called thermal grease or thermal compound, heatsink compound is created to increase effective heat transfer between a device such as a CPU and the heatsink connected to the device. A heatsink is usually designed with a flat surface intended to come into contact with the CPU or similar device. During standard usage of a computer, the CPU and other components can produce a great deal of heat, which can cause problems for the computer including hardware damage. In order to alleviate this heat buildup, heat is transferred by physical contact from the CPU into the heatsink, where it is then distributed into the air and fans move the heat out of the computer.


Q7: What heat sink design software being used usually?


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