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Heat Sink Extrusion

An extruded heat sink is used mainly to increase the area available for heat dissipation from electronic devices, the purpose is to reduce the devices external case temperature, also its internal junction temperature. then it can improve the performance of electronic devices to the best status, with maximum reliability. Such semiconductor devices include (but are not limited to) RF power transistors, RF power amplifiers, Power MOSFETs, IGBTs, inverter power modules, and thyristor modules. In some power conversion circuit applications, large diodes, rectifiers, diode modules and even high-power resistors (thick film, etc.) can also require thermal contact with an heat sink extrusion.

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